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5G High Speed PCB Design Server Communication Electronic Equipment PCB

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5G High Speed PCB Design Server Communication Electronic Equipment PCB

Model Number : XSWPCB

Material : FR4

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : Green

Payment Terms : Western Union

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1 oz

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.6 mm (Customizable)

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 6-Layer

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5G Printed Circuit Board Server Communication Electronic Equipment PCB High Speed

The 5G Printed Circuit Board (PCB) for Server Communication Electronic Equipment is specifically designed to meet the demanding requirements of high-speed data transmission, cloud computing, telecommunications infrastructure, and next-generation 5G networks. Built with advanced multilayer PCB technology and high-performance low-loss materials, this PCB delivers exceptional signal integrity, stable power distribution, and superior electromagnetic compatibility.

Key Specifications
Layer Count 6-Layer
Material FR4
Board Thickness 1.6 mm (Customizable)
Copper Thickness 1/1/1/1/1/1 oz
Minimum Hole Size 0.25 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish ENIG

Product Description

  • High-Speed Data Processing
    • Designed to handle large volumes of data with minimal latency.
    • Supports advanced server and networking architectures.
  • Excellent Signal Integrity
    • Controlled impedance design minimizes signal loss and crosstalk.
    • Ensures reliable performance for high-speed communication protocols.
  • Multilayer PCB Construction
    • Provides dedicated power and ground planes for stable signal routing.
    • Supports complex circuit designs and dense component placement.
  • Low-Loss Material Compatibility
    • Available with high-frequency materials for superior transmission performance.
    • Ideal for RF and microwave communication applications.
  • Superior EMI/EMC Performance
    • Advanced layer stack-up reduces electromagnetic interference.
    • Enhances communication stability in high-density electronic systems.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm

Product Tags:

5G High Speed PCB Design

      

Communication Electronic Equipment PCB

      
Quality 5G High Speed PCB Design Server Communication Electronic Equipment PCB for sale

5G High Speed PCB Design Server Communication Electronic Equipment PCB Images

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