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Custom Multilayer PTFE High Frequency Printed Circuit Board For 5G Base Station RF Module

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Custom Multilayer PTFE High Frequency Printed Circuit Board For 5G Base Station RF Module

Name: Custom Multilayer PTFE High Frequency Printed Circuit Board For 5G Base Station RF Module
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : PTFE

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : ENIG

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 2.0 mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1/1/1 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 8-Layer

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Custom Multilayer PTFE High Frequency PCB Board For 5G Base Station RF Module

This custom multilayer PTFE high frequency PCB is engineered for 5G base station RF front-end modules, phased array antennas and microwave signal transmission. Adopting high-performance PTFE (Teflon) dielectric substrate, the circuit board features ultra-low dielectric constant (Dk) and extremely low dissipation factor (Df), effectively reducing insertion loss and signal distortion under GHz & millimeter wave frequency bands.

Key Specifications

Layer Count	8-Layer
Material	PTFE
Board Thickness	2.0 mm (Customizable)
Copper Thickness	1/1/1/1/1/1/1/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

1.Premium PTFE base material, ultra-low Dk & Df, minimum signal attenuation at microwave & mmWave frequency
2.Custom multilayer structure available, support hybrid stack-up of PTFE + FR4 composite boards
3.Strict impedance control (50Ω/75Ω etc.), consistent impedance tolerance for RF transmission lines
4.Excellent dielectric stability, Dk barely fluctuates with temperature and frequency changes
5.Low moisture absorption, outstanding chemical resistance and wide operating temperature range
6.Adopt LDI laser direct imaging technology, high precision fine trace & space manufacturing
7.Multiple surface treatment options: Immersion gold, hard gold, HASL, OSP to meet soldering requirements
8.Low dielectric loss, greatly improve transmission efficiency of 5G RF & microwave signals

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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